DC 340

Dow Corning 340 sink heat compound is a non-curing silicone compound designed to provide a long term thermal bridge between power components and heat sinks

FEATURES AND BENEFITS

  • High thermal conductivity
  • Low bleed
  • Non-sag

INSTRUCTIONS FOR USE

  • Designed to provide a long term thermal bridge between power components and heat sinks
  • Typical applications include: thermally connecting transistors and thyristors to heat sinks

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